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MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
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机译:铜包层压板和印刷配线板的制造方法
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摘要
Provided is a manufacturing method for a copper-clad laminate in which a copper foil and a resin are bonded with high heat-resistant adhesive strength while using a fluororesin, which is a thermoplastic resin having a low dielectric constant. This manufacturing method comprises: a step for preparing a surface-treated copper foil, which includes a copper foil and a zinc-containing layer provided on at least one surface of the copper foil; and a step for obtaining a copper-clad laminate by attaching a sheet-like fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of at least 1,200ºC. When the boundary surface between the copper foil and the zinc-containing layer is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), the content of Zn is at most 10 wt%, and the Zn/M weight ratio, which is the ratio of the content of Zn to the content of the transition element M, is 0.2-0.6.
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