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MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD

机译:铜包层压板和印刷配线板的制造方法

摘要

Provided is a manufacturing method for a copper-clad laminate in which a copper foil and a resin are bonded with high heat-resistant adhesive strength while using a fluororesin, which is a thermoplastic resin having a low dielectric constant. This manufacturing method comprises: a step for preparing a surface-treated copper foil, which includes a copper foil and a zinc-containing layer provided on at least one surface of the copper foil; and a step for obtaining a copper-clad laminate by attaching a sheet-like fluororesin to the zinc-containing layer side of the surface-treated copper foil. The zinc-containing layer is composed of Zn and a transition element M having a melting point of at least 1,200ºC. When the boundary surface between the copper foil and the zinc-containing layer is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), the content of Zn is at most 10 wt%, and the Zn/M weight ratio, which is the ratio of the content of Zn to the content of the transition element M, is 0.2-0.6.
机译:提供了一种用于铜包覆层压板的制造方法,其中铜箔和树脂在使用氟树脂的同时用高耐热粘合强度粘合,这是具有低介电常数的热塑性树脂。该制造方法包括:用于制备表面处理过的铜箔的步骤,其包括铜箔和设置在铜箔的至少一个表面上的含锌层;并通过将片状氟树脂连接到表面处理过的铜箔的含锌层侧来获得铜包层层压体的步骤。含锌层由Zn和过渡元件M组成,其熔点至少为1,200℃。当通过X射线光电子谱(XPS)进行铜箔和含锌层之间的边界表面进行元素分析时,Zn的含量为10wt%,Zn / m重量比为Zn含量与过渡元素M的含量的比率为0.2-0.6。

著录项

  • 公开/公告号WO2022014647A1

    专利类型

  • 公开/公告日2022-01-20

    原文格式PDF

  • 申请/专利权人 MITSUI MINING & SMELTING CO. LTD.;

    申请/专利号WO2021JP26505

  • 发明设计人 NAKAJIMA DAISUKE;KAWAGUCHI SHOTA;

    申请日2021-07-14

  • 分类号C25D7/06;B32B15/082;B32B15/20;H05K3/38;

  • 国家 JP

  • 入库时间 2022-08-24 23:29:43

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