Method of Bonding Copper Pillar to PCB Using Mask

摘要

The present invention relates to a method for bonding a copper filler substrate using a mask, and more particularly, to a method for bonding a copper filler substrate using a mask for effectively arranging a cylindrical copper pillar on a substrate and bonding with high precision. The copper filler substrate bonding method using the mask of the present invention has the effect of quickly and effectively placing the copper filler on the substrate and bonding the copper filler without omission of the copper filler. In addition, the method of bonding a copper filler substrate using a mask of the present invention has an effect of effectively performing a process of mounting a copper filler having a very small size on a substrate.