METHOD OF BONDING COPPER PILLAR SUBSTRATE BONDING USING MASK

摘要

The present invention relates to a method of bonding a copper pillar substrate using a mask, and more specifically, to a method of bonding a copper pillar substrate using a mask, wherein copper pillars in the shape of cylinders are effectively positioned on a substrate and bonded thereon with high precision. The method of bonding a copper pillar substrate using a mask of the present invention has an advantage in that the copper pillars can be effectively positioned without loss on the substrate and bonded thereon. In addition, the method of bonding a copper pillar substrate using a mask of the present invention has the advantage of effectively performing the process of mounting copper pillars of an extremely small size on substrates.