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Role of hydrogen bond connecting ligands for substrate and type i copper in copper(i) oxidase cueo

机译:连接配体的氢键作用于铜(i)氧化酶cueo中的底物和i型铜

摘要

Mutational and kinetic studies on Asp439, a ligand for the substrate-binding site in the copper(I) oxidase—CueO—and the deletion mutant—Δα5–7 CueO—indicated that the electron transfer from the copper(I) ion as the substrate to the type I copper is performed though the hydrogen bond between Asp439 and His443, a ligand for the type I copper, and also by means of the through-space mechanism directly.
机译:对Asp439的突变和动力学研究,Asp439是铜(I)氧化酶-CueO-和缺失突变体-Δα5-7CueO-的底物结合位点的配体,表明电子从作为底物的铜(I)离子转移通过Asp439和His443(I型铜的配体)之间的氢键进行I型铜的缩合反应,也可以直接通过贯通空间机理进行。

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