A polyamic acid composition for producing a polyimide resin having excellent adhesive strength and a polyimide resin produced thereby.

摘要

In the present invention, a diamine monomer containing a first dianhydride having one benzene ring and a second dianhydride having a benzophenone structure, and a diamine monomer containing the compound represented by the compound (1) are used. It contains a polymerized polyamic acid and an organic solvent, and the molar ratio of the second diamine hydride to the first diamine hydride (= the number of moles of the second diamine hydride / the number of moles of the first diamine hydride) is 0. A polyamic acid composition of 2-1.2 is provided.