首页> 外国专利> Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member

Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member

机译:发光元件安装基部构件的制造方法,使用发光元件安装基部构件,发光元件安装基部构件以及使用发光元件安装基部构件的发光元件安装基部构件的发光器件的方法

摘要

A method of manufacturing a light emitting element mounting base member includes: providing a first insulating member in a plate shaped having at least one recess portion or at least one through-hole; disposing in the recess portion or in the through-hole a light blocking resin and a plurality of core members each equipped with a second insulating member having light reflectivity on each surface of a plurality of electrical conductor cores; and exposing at least one of the surface of the electrical conductor cores from the second insulating members by removing each part of at least one of the second insulating members.
机译:一种制造发光元件安装基座构件的方法包括:在板状中提供具有至少一个凹陷部分或至少一个通孔的板的第一绝缘构件; 在凹陷部分中或在通孔中设置在透光树脂和多个芯构件,每个芯构件配备有多个电导体芯的每个表面上具有光反射率的第二绝缘构件; 通过去除第二绝缘构件中的至少一个的每个部分,从第二绝缘构件暴露电导体芯的至少一个表面。

著录项

  • 公开/公告号US11223000B2

    专利类型

  • 公开/公告日2022-01-11

    原文格式PDF

  • 申请/专利权人 NICHIA CORPORATION;

    申请/专利号US202016831812

  • 发明设计人 YUKITOSHI MARUTANI;

    申请日2020-03-27

  • 分类号H01L33;H01L33/62;H01L25/075;H01L25/13;H01L25;H01L33/58;H01L23/492;H01L23/498;H01S5/023;H01S5/0233;H01S5/0235;H01L33/60;

  • 国家 US

  • 入库时间 2024-06-14 22:40:51

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