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CERAMIC-CLADDED COPPER PLATE AND METHOD FOR MANUFACTURING CERAMIC-CLADDED COPPER PLATE

机译:陶瓷包覆铜板及制造陶瓷包覆铜板的方法

摘要

Provided is a method for manufacturing a ceramic-cladded copper plate, comprising the following steps: providing a copper material; forming a copper oxide layer on the surface of the copper material; heat treating the copper material on which the copper oxide layer is formed so that oxygen atoms are diffused in the copper material; removing the copper oxide layer from the heat-treated copper material; and soldering a ceramic substrate to the copper material from which the copper oxide layer is removed to produce a ceramic-cladded copper plate.
机译:提供了一种制造陶瓷包覆铜板的方法,包括以下步骤:提供铜材料; 在铜材料表面上形成氧化铜层; 热处理形成氧化铜层的铜材料,使得氧原子在铜材料中扩散; 从热处理的铜材料中除去氧化铜层; 并将陶瓷基板焊接到除去氧化铜层以产生陶瓷包覆的铜板的铜材料。

著录项

  • 公开/公告号WO2022001983A1

    专利类型

  • 公开/公告日2022-01-06

    原文格式PDF

  • 申请/专利权人 BYD COMPANY LIMITED;

    申请/专利号WO2021CN102841

  • 发明设计人 ZHOU WEI;XU QIANG;XIE SISI;

    申请日2021-06-28

  • 分类号H05K3/02;C04B37/02;

  • 国家 CN

  • 入库时间 2024-06-14 22:40:41

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