THERMOSETTING RESIN COMPOSITION FOR CONTINUOUSLY MANUFACTURED COPPER-CLAD LAMINATION PLATE, CONTINUOUS MANUFACTURING METHOD FOR COPPER-CLAD LAMINATION PLATE, AND COPPER-CLAD LAMINATION PLATE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition applicable for continuous production of a copper-clad lamination plate in which quick curing property suitable for continuous production is maintained and the obtained cured substance has characteristic of an epoxy resin, a copper-clad lamination plate using the composition, and a manufacturing method for the copper-clad lamination plate.;SOLUTION: The thermosetting resin composition contains a liquid resin component containing a styrene based monomer and the epoxy resin containing two or more of epoxy groups in one molecule, an organic peroxide, an imidazole based curing promotor, and an inorganic filler. In the thermosetting resin composition for the continuously produced copper-clad lamination plate, 10-50 mass% of the styrene based monomer is contained in the liquid resin component.;COPYRIGHT: (C)2009,JPO&INPIT