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3D IMAGE ACQUISITION SYSTEM FOR OPTICAL INSPECTION AND METHOD FOR OPTICAL INSPECTION OF OBJECTS, IN PARTICULAR ELECTRONIC ASSEMBLIES, ELECTRONIC BOARDS AND THE LIKE
3D IMAGE ACQUISITION SYSTEM FOR OPTICAL INSPECTION AND METHOD FOR OPTICAL INSPECTION OF OBJECTS, IN PARTICULAR ELECTRONIC ASSEMBLIES, ELECTRONIC BOARDS AND THE LIKE
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机译:用于光检查和对象光学检查的光检查和方法的图像采集系统,特别是电子组件,电子板等
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摘要
Automatic 3D image acquisition system (1, 10, 100) for optical inspection of objects (B), in particular electronic assemblies, electronic boards and the like, comprising: one or more light sources (21, 22) configured to emit a light (2, 3) toward a field of view (11) wherein an object (B) to be inspected is placed, and at least one digital sensor (31, 32, 33) that acquires at least part of the light (2, 3) reflected by the object (B) to be inspected, the digital sensor (31, 32, 33) being operatively connected to a data processing unit (90) configured to determine physical and/or geometric features of the object (B) to be inspected on the basis of the light (2', 3AB) acquired by the digital sensor (31, 32, 33). The light sources (21, 22) comprise a laser source (22) configured to generate laser light pulses (2), the digital sensor (31, 32, 33) comprises an intensity sensor (33), and the automatic optical inspection system (1, 10, 100) further comprises: an image intensifier apparatus (60), and a plurality of optical elements (48, 55, 49, 57) which define a path (4) of the laser light pulse (2) from the laser source (22) to the field of view (11) and from the field of view (11) to the image intensifier apparatus (60). The image intensifier apparatus (60) is configured to be switched from an open condition to a closed condition and vice versa [in ultra-fast manner] during the inspection of the object.
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