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Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
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机译:半导体封装在封装室内舱内屏蔽和主动电磁兼容性屏蔽
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摘要
A semiconductor package includes a substrate having a semiconductor chip disposed on a top surface of the substrate, a ground ring surrounding the semiconductor chip on the top surface of the substrate, a metal-post reinforced glue wall disposed on the ground ring to surround the semiconductor chip, and a molding compound disposed only inside the metal-post reinforced glue wall and covering the semiconductor chip. The metal-post reinforced glue wall comprises a magnetic or magnetizable filler so as to form an active electro-magnetic compatibility (EMC) shielding.
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