SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND ACTIVE ELECTRO-MAGNETIC COMPATIBILITY SHIELDING

摘要

The semiconductor package includes a substrate including a semiconductor chip disposed on an upper surface, a ground ring surrounding the semiconductor chip on the upper surface of the substrate, a metal post reinforced adhesive wall disposed on the ground ring to surround the semiconductor chip, and And a molding compound disposed only inside the metal post reinforced adhesive wall and covering the semiconductor chip. The metal post reinforced adhesive wall includes a magnetic or magnetizable filler to form an active electromagnetic compatibility (EMC) shield.