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Parts sorting device for semiconductor process and parts sorting method by this

机译:半导体工艺的零件分拣装置和零件排序方法

摘要

PROBLEM TO BE SOLVED: To provide a component alignment device for a semiconductor process and a component alignment method using the component alignment device. The present invention relates to a component alignment device for a semiconductor process and a component alignment method using the component alignment device. The component alignment device for the semiconductor process is a loading unit 11 in which components are loaded while being formed so as to be located at a finger 12 coupled to the transfer means 15; an operation control unit having a communication means arranged in the loading unit 11. 13; and at least one vision unit 14; [Selection diagram] Fig. 1
机译:要解决的问题:提供用于半导体过程的组件对准装置和使用分量对准装置的组件对准方法。 本发明涉及一种用于半导体处理的组件对准装置和使用分量对准装置的组件对准方法。 用于半导体工艺的组件对准装置是装载单元11,在该装载单元11中,在该装载单元11,在该装载单元11,在该装载单元11上装载成部件以便位于连接到传送装置15的手指12处; 操作控制单元,其具有布置在装载单元11中的通信装置。 和至少一个视觉单元14; [选择图]图1

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