Board warp correction method, computer storage medium and board warp correction device

摘要

The method for correcting the warp of the substrate according to the present disclosure corrects the warp of the substrate without processing the surface of the substrate. In this method of correcting the warp of a substrate, the back surface of the substrate is roughened by using a roughening treatment device configured to be capable of roughening the back surface of the substrate, and a groove is formed on the back surface. Includes a roughening step to correct the warpage of the substrate.