FLOW SOLDERING DEVICE PROVIDED WITH WARP CORRECTION MECHANISM OF ELECTRONIC CIRUIT BOARD AND WARP CORRECTION METHOD

摘要

PROBLEM TO BE SOLVED: To highly precisely correct the warp of a board, which occurs by flow soldering, to a flat state by holding the electronic circuit board to the flat state by backup pins and correction jigs and cooling the electronic circuit board by a cooling fan so that it becomes not more than a glass transfer temperature. ;SOLUTION: A board heating process is provided in the middle of a process where the temperature of a board 1 drops by natural cooling after soldering for correcting the warp of the board 1 and the board 1 is kept to be not less than a glass transfer temperature. Then, a board correction process is installed immediately after and the board 1 is sandwiched by backup pins 5 and correction pins 6 from a vertical direction in the process, and it is kept until the temperature becomes not more than the glass transfer temperature at which the board 1 is cured. The correction pins 6 and the backup pins 5 are installed on moving means 9A and 9B, they move to positions where they do not interfere with an electronic part 2 and they press the board 1. The warp of the board 1 is eliminated and it can be corrected to a flat state with such constitution.;COPYRIGHT: (C)2000,JPO