A method of marking a semiconductor wafer with an alignment mark and a semiconductor package having an alignment mark portion.

摘要

Some embodiments include semiconductor packages. The semiconductor package has a semiconductor die having a main region including an integrated circuit and an end region including a portion of the alignment mark position. The portion of the alignment mark position contains a fragment of the alignment mark. Alignment marks include a pattern of lines and spaces, the lines extending along the first direction. The portion of the alignment mark position also includes a texture having a pattern other than a line extending along either the first direction or the second direction substantially orthogonal to the first direction. Some embodiments include methods for aligning and marking semiconductor wafers.