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Chip on film package including a protection layer and display device including the chip on film package
Chip on film package including a protection layer and display device including the chip on film package
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机译:芯片封装上的芯片,包括保护层和显示装置,包括薄膜包装上的芯片
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摘要
A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.
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