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CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE CHIP ON FILM PACKAGE
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE CHIP ON FILM PACKAGE
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机译:胶片包装和显示装置上的芯片,包括胶片包装上的芯片
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摘要
A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.
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