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Material for forming nucleation inhibiting coating and device comprising same

机译:形成成核抑制涂层的材料和包含该卷的装置

摘要

The optoelectronic device may include a nucleation inhibiting coating (NIC) disposed on a surface of the device in a first portion of a lateral side of the device; and a conductive coating disposed on a surface of the device at a second portion of the lateral side of the device, wherein an initial sticking probability of the conductive coating is greater for the NIC than for the surface of the first portion. substantially lower, the first portion being substantially free of conductive coating; NIC includes compounds having a formula as exemplified by formula (I):
机译:光电子器件可包括设置在装置的第一部分的装置的表面上的核切割抑制涂层(NIC); 并且在装置的侧面的第二部分处设置在装置的第二部分的表面上的导电涂层,其中导电涂层的初始粘附概率比第一部分的表面更大。 基本上更低,第一部分基本上不含导电涂层; NIC包括具有公式(I)示例的配方的化合物:

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