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Polymers, conductive paste compositions, binder resins for ceramics, ceramic slurry compositions and binder resins for conductive pastes
Polymers, conductive paste compositions, binder resins for ceramics, ceramic slurry compositions and binder resins for conductive pastes
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机译:聚合物,导电糊剂组合物,陶瓷,陶瓷浆料组合物和用于导电浆料的陶瓷浆料组合物和粘合剂树脂
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摘要
PROBLEM TO BE SOLVED: To provide a polymer capable of providing a paste having excellent thixotropy property, no stringiness or bleeding during printing, and excellent thermal decomposition property. SOLUTION: The molar ratio of the monomer (A) represented by the formula (1) is 10 mol% to 100 mol%, and the molar ratio of another monomer (B) copolymerizable with the monomer (A) is 0 to 0. A polymer having a weight average molecular weight of 90 mol% and a weight average molecular weight of 10,000 to 1,000,000. (Chemical formula 1) (R1 represents a hydrogen atom or a methyl group, R2 represents an alkyl group having 1 to 18 carbon atoms or a hydroxyalkyl group having 1 to 18 carbon atoms, and A represents an alkyl group having 1 to 18 carbon atoms and 10 or less carbon atoms. Indicates an alkylene group of, X indicates 0 or 1, and Y1 is one or more structures selected from the group consisting of hydroxyurethane structures of the formulas (2) and (3).) [Selection diagram] None.
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