首页> 外国专利> Polymer, conductive paste composition, binder resin for ceramics, ceramic slurry composition and binder resin for conductive paste

Polymer, conductive paste composition, binder resin for ceramics, ceramic slurry composition and binder resin for conductive paste

机译:聚合物,导电浆料组合物,用于陶瓷,陶瓷浆料组合物和用于导电浆料的粘合剂树脂的粘合剂树脂

摘要

(Project) To provide a polymer capable of providing a paste having excellent thixotropic properties, no thread dragging or bleeding during printing, and excellent thermal decomposition properties. (Solution) The molar ratio of the monomer (A) represented by the formula (1) is 10 mol% to 100 mol%, the molar ratio of the monomer (A) and the other copolymerizable monomer (B) is 0 to 90 mol%, a weight average A polymer having a molecular weight of 10,000 to 1,000,000. (R 1 represents a hydrogen atom or a methyl group, R 2 represents an alkyl group having 1 to 18 carbon atoms or a hydroxyalkyl group having 1 to 18 carbon atoms, A represents an alkylene group having 1 or more and 10 or less carbon atoms, X represents 0 or 1, and Y 1 is at least one structure selected from the group consisting of hydroxyurethane structures of formulas (2) and (3).)
机译:(项目)提供能够提供具有优异触变性特性的糊剂的聚合物,在印刷期间没有螺纹拖曳或出血,以及优异的热分解特性。 (溶液)由式(1)表示的单体(A)的摩尔比为10mol%至100mol%,单体(a)和其他可共聚单体(b)的摩尔比为0至90摩尔 %,分子量为10,000至1,000,000的聚合物的重量平均值。 (R 1表示氢原子或甲基,R 2表示具有1至18个碳原子的烷基或具有1至18个碳原子的羟基烷基,A表示具有1或更多和10或更小的碳原子的亚烷基 ,X表示0或1,Y 1是选自式(2)和(3)的羟基氨基乙烷结构的至少一种结构。)

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号