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Polymer, conductive paste composition, binder resin for ceramics, ceramic slurry composition and binder resin for conductive paste
Polymer, conductive paste composition, binder resin for ceramics, ceramic slurry composition and binder resin for conductive paste
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机译:聚合物,导电浆料组合物,用于陶瓷,陶瓷浆料组合物和用于导电浆料的粘合剂树脂的粘合剂树脂
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摘要
(Project) To provide a polymer capable of providing a paste having excellent thixotropic properties, no thread dragging or bleeding during printing, and excellent thermal decomposition properties. (Solution) The molar ratio of the monomer (A) represented by the formula (1) is 10 mol% to 100 mol%, the molar ratio of the monomer (A) and the other copolymerizable monomer (B) is 0 to 90 mol%, a weight average A polymer having a molecular weight of 10,000 to 1,000,000. (R 1 represents a hydrogen atom or a methyl group, R 2 represents an alkyl group having 1 to 18 carbon atoms or a hydroxyalkyl group having 1 to 18 carbon atoms, A represents an alkylene group having 1 or more and 10 or less carbon atoms, X represents 0 or 1, and Y 1 is at least one structure selected from the group consisting of hydroxyurethane structures of formulas (2) and (3).)
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