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BVH METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD WITH BVH

机译:具有BVH的柔性印刷电路板的BVH方法

摘要

A flexible printed circuit board manufacturing method is disclosed, wherein the flexible printed circuit board manufacturing method comprises: (a) a first laminate and a second laminate including a polyimide layer and copper layers formed on both surfaces of the polyimide layer; processing bvh on one side; (b) the first laminate and the second laminate so that one surface of each of the first and second laminates processed by bvh faces one side and the other side, and the other surfaces face each other with a tape interposed therebetween and laminating a tape to prepare a main laminate in which the bvh is processed on one side and the other side; (c) applying chemical copper to one surface and the other surface of the main laminate; (d) performing copper plating on one surface and the other surface of the main laminate; (e) patterning one surface and the other surface of the main laminate; (f) laminating an outer layer on one surface and the other surface of the main laminate; and (g) separating the main laminate into the first and second laminates, wherein steps (a) to (e) are performed by a roll-to-roll method.
机译:公开了一种柔性印刷电路板制造方法,其中,柔性印刷电路板制造方法包括:(a)第一层压板和第二层压板,包括形成在聚酰亚胺层的两个表面上的聚酰亚胺层和铜层;在一侧加工BVH; (b)第一层压板和第二层叠体使得由BVH处理的第一和第二层压板中的每一个的一个表面面向一侧和另一侧,并且另一个表面彼此面对,用胶带介于它们之间并将胶带层压到准备一个主层压板,其中BVH在一侧和另一边加工; (c)将化学铜施加到一个表面和主层压板的另一个表面; (d)在一个表面上进行铜电镀和主层压板的另一个表面; (e)图案化一个表面和主层压板的另一个表面; (f)在一个表面和主层压板的另一个表面层叠外层; (g)将主层压材料分离到第一和第二层压板中,其中步骤(a)至(e)通过卷到卷法进行。

著录项

  • 公开/公告号KR102330334B1

    专利类型

  • 公开/公告日2021-11-24

    原文格式PDF

  • 申请/专利权人 주식회사 에스아이 플렉스;

    申请/专利号KR20200114072

  • 发明设计人 정의남;

    申请日2020-09-07

  • 分类号H05K3/42;H05K3/28;H05K3/46;

  • 国家 KR

  • 入库时间 2022-08-24 22:31:41

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