首页> 外国专利> MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACTURING JIG FOR FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING DEVICE FOR FLEXIBLE PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD, MANUFACTURING JIG FOR FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING DEVICE FOR FLEXIBLE PRINTED CIRCUIT BOARD

机译:挠性印刷电路板的制造方法,挠性印刷电路板的制造夹具和挠性印刷电路板的制造装置

摘要

To provide a manufacturing method of a flexible printed circuit board which facilitates handling of an auxiliary material and is capable of improving production efficiency, a manufacturing jig for the flexible printed circuit board and a manufacturing device for the flexible printed circuit board.SOLUTION: A manufacturing method of a flexible printed circuit board includes: an auxiliary material setting step for setting an auxiliary material 21 in a cut portion 32 of a manufacturing jig 30 when setting an auxiliary material sheet 20 to the manufacturing jig 30; a punch member setting step for setting a punch member 33 which is abutted to a frame-shaped scrap part 22, in a state where a window part 33a is aligned with the auxiliary material 21 in the cut portion 32; an intermediate product setting step for aligning and setting an intermediate product 10 to the punch member 33; a cutting step for pressing the punch member 33 to the auxiliary material sheet 20 and separating the auxiliary material 21 from the frame-shaped scrap part 22; and a fixing step for fixing the auxiliary material 21 to the intermediate product 10 in an aligned state.SELECTED DRAWING: Figure 6
机译:为了提供一种便于处理辅助材料并能够提高生产效率的柔性印刷电路板的制造方法,用于该柔性印刷电路板的制造夹具以及用于该柔性印刷电路板的制造装置。柔性印刷电路板的方法包括:辅助材料设置步骤,用于在将辅助材料片20设置到制造夹具30时将辅助材料21设置在制造夹具30的切口部分32中。冲孔构件设置步骤,用于在窗口部分33a与辅助材料21在切口部分32中对准的状态下,设置与框状废料部分22邻接的冲孔构件33。中间产品设置步骤,用于将中间产品10对准并设置在冲头部件33上。切割步骤,用于将冲头构件33压在辅助材料片20上并将辅助材料21与框架状的废料部分22分离。图6是用于将辅助材料21固定在中间产品10上的固定步骤。

著录项

  • 公开/公告号JP2019046988A

    专利类型

  • 公开/公告日2019-03-22

    原文格式PDF

  • 申请/专利权人 NIPPON MEKTRON LTD;

    申请/专利号JP20170169200

  • 发明设计人 TOMINAGA TAKASHI;

    申请日2017-09-04

  • 分类号H05K3;H05K1/02;B26F1;

  • 国家 JP

  • 入库时间 2022-08-21 12:23:45

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号