Pure copper powder having Si film, manufacturing method thereof, and laminated sculpture using the pure copper powder

摘要

Pure copper powder having a Si film formed thereon, wherein the Si adhesion amount is 5 wtppm or more and 200 wtppm or less, the C adhesion amount is 15 wtppm or more, and the weight ratio C/Si is 3 or less. The present invention suppresses partial sintering due to preheating of pure copper powder in lamination molding by the electron beam (EB) method, and suppresses a decrease in the vacuum degree during molding due to carbon (C) during molding. An object of the present invention is to provide a pure copper powder having a Si film formed thereon, a method for producing the same, and a laminated article using the pure copper powder.