Plasma processing apparatus with improved anti-plasma corrosion

摘要

The present invention relates to a plasma processing apparatus, comprising: a chamber in which plasma processing is performed; a substrate support provided in the chamber on which a wafer is mounted; a ring-shaped structure formed to surround the circumference of the wafer in a circle; a shower head provided in the chamber to supply gas to an upper portion of the wafer; and an upper electrode provided under the shower head, wherein the ring-shaped structure and the upper electrode are formed of boron carbide material and have excellent corrosion resistance and thus have a long lifespan.