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PARTS OF SEMICONDUCTOR AND DISPLAY EQUIPMENTS WITH IMPROVED ANTI-PLASMA CORROSION AND METHOD IMPROVING ANTI-PLASMA CORROSION OF PARTS
PARTS OF SEMICONDUCTOR AND DISPLAY EQUIPMENTS WITH IMPROVED ANTI-PLASMA CORROSION AND METHOD IMPROVING ANTI-PLASMA CORROSION OF PARTS
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机译:具有改善的抗等离子腐蚀性能的半导体和显示设备零件以及改善零件的抗等离子腐蚀性能的方法
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摘要
To solve a problem that the process component of semiconductor or display manufacturing equipment is etched by the exposure of plasma, the present invention relates to a method of processing anti-plasma corrosion of a process component by removing peaks and valleys of the surface of ceramic powder (the surface of a coating layer and the surface of the process component) before and after powder coating is performed on the process component, and the process component with improved anti-plasma corrosion. Provided is a process component of semiconductor or display manufacturing equipment exposed by plasma. A coating layer is formed on the surface of a main body where valleys and peaks are partly or totally removed. Provided is a process component with improved anti-plasma corrosion where valleys and peaks are partly or totally removed on the surface of a coating layer.
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