HEAT-RESISTANCE MASKING TAPE HAVING IMPROVED ANTI-PLASMA FOR SEMICONDUCTOR PRODUCTION PROCESS

摘要

The present invention relates to a heat-resistant adhesive masking tape having improved anti-plasma performance for a semiconductor manufacturing process, wherein an adhesive layer is not adhesive at room temperature, but only expresses adhesiveness during a thermal lamination process, thus enabling lamination on a lead frame, and also has excellent heat-resistance with regard to a thermal history in which the adhesive tape is exposed during the manufacturing process of a semiconductor device. The heat-resistant adhesive masking tape of the present invention improves device reliability during the manufacturing process of a semiconductor device and prevents leakage of encapsulation materials, and further prevents the transfer of adhesives to the lead frame or encapsulating material when removing the tape after the process is finished.