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VACUUM PAD CAPABLE OF EASILY DESTICKING ELECTRONIC CHIPS VACUUM CHUCK TABLE AND PICKER HAVING THE SAME AND PICK-UP METHOD OF ELECTRONIC CHIPS BY THE SAME
VACUUM PAD CAPABLE OF EASILY DESTICKING ELECTRONIC CHIPS VACUUM CHUCK TABLE AND PICKER HAVING THE SAME AND PICK-UP METHOD OF ELECTRONIC CHIPS BY THE SAME
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机译:真空垫,能够易于去射击电子芯片真空夹头表和拾取器,具有相同的电子芯片的电子芯片
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摘要
The present invention relates to a vacuum pad for easy detachment of electronic component chips, a vacuum chuck table and a picker including the same, and a method for picking up electronic component chips using the same, and more particularly, to a vacuum pad used for a vacuum chuck. It relates to a vacuum pad from which electronic component needles are easily separated by lowering the surface tension generated between the electronic component chip and the vacuum pad by engraving the , a vacuum chuck table and a picker including the same, and a method for picking up an electronic component chip using the same. The present invention has the effect of reducing the surface tension of water remaining between the vacuum pad and the electronic component, so that the electronic component chip can be easily picked up and transported by the picker.
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