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SEMICONDUCTOR DEVICE WITH METAL-SEMICONDUCTOR CONTACTS INCLUDING OXYGEN INSERTION LAYER TO CONSTRAIN DOPANTS AND RELATED METHODS

机译:具有金属半导体触点的半导体器件,包括氧气插入层,以约束掺杂剂和相关方法

摘要

A semiconductor device may include a semiconductor layer and at least one contact in the semiconductor layer. The contact may include at least one oxygen monolayer constrained within a crystal lattice of adjacent semiconductor portions of the semiconductor layer and spaced apart from a surface of the semiconductor layer by between one and four monolayers, and a metal layer on the surface of the semiconductor layer above the at least one oxygen monolayer. The semiconductor portion between the oxygen monolayer and the metal layer may have a dopant concentration of 1×1021 atoms/cm3 or greater.
机译:半导体器件可以包括半导体层和半导体层中的至少一个接触。 接触可包括至少一个约束在半导体层的相邻半导体部分的晶格内的氧单层,并通过在一个和四个单层之间与半导体层的表面间隔开,以及半导体层表面上的金属层 在至少一个氧单层上方。 氧单层和金属层之间的半导体部分可具有1×1021原子/ cm3或更大的掺杂剂浓度。

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