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SEMICONDUCTOR DEVICE WITH METAL-SEMICONDUCTOR CONTACTS INCLUDING OXYGEN INSERTION LAYER TO CONSTRAIN DOPANTS AND RELATED METHODS
SEMICONDUCTOR DEVICE WITH METAL-SEMICONDUCTOR CONTACTS INCLUDING OXYGEN INSERTION LAYER TO CONSTRAIN DOPANTS AND RELATED METHODS
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机译:具有金属半导体触点的半导体器件,包括氧气插入层,以约束掺杂剂和相关方法
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摘要
A semiconductor device may include a semiconductor layer and at least one contact in the semiconductor layer. The contact may include at least one oxygen monolayer constrained within a crystal lattice of adjacent semiconductor portions of the semiconductor layer and spaced apart from a surface of the semiconductor layer by between one and four monolayers, and a metal layer on the surface of the semiconductor layer above the at least one oxygen monolayer. The semiconductor portion between the oxygen monolayer and the metal layer may have a dopant concentration of 1×1021 atoms/cm3 or greater.
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