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METHOD OF FINE REDISTRIBUTION INTERCONNECT FORMATION FOR ADVANCED PACKAGING APPLICATIONS
METHOD OF FINE REDISTRIBUTION INTERCONNECT FORMATION FOR ADVANCED PACKAGING APPLICATIONS
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机译:用于高级包装应用的精细再分配互连方法
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摘要
A method for producing an electrical component is disclosed using a molybdenum adhesion layer, connecting a polyimide substrate to a copper seed layer and copper plated attachment.
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