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Temperature effect compensation in memory arrays

机译:内存阵列中的温度效应补偿

摘要

A memory system having a temperature effect compensation mechanism is provided. The memory system may include a plurality of memory cells, where the memory cells are organized in an array having two or more rows of memory cells arranged horizontally and two or more columns of memory cells arranged vertically. The plurality of memory cells may have an operating temperature range. The memory system may also include a temperature-dependent biasing circuit that is configured to reduce a biasing voltage to the plurality of memory cells when the temperature of the array is at or near an upper end of the operating temperature range and increase the biasing voltage to the plurality of memory cells when the temperature of the array is at or near a lower end of the operating temperature range.
机译:提供了一种具有温度效应补偿机构的存储器系统。 存储器系统可以包括多个存储器单元,其中存储器单元被组织成具有两个或多个存储器单元的阵列,水平地布置,以及垂直布置的两个或更多个存储器单元。 多个存储器单元可以具有操作温度范围。 存储器系统还可以包括温度相关的偏置电路,该电路被配置为当阵列的温度在工作温度范围的上端或附近的阵列处或靠近偏置电压时将偏置电压降低到多个存储器单元。 当阵列的温度处或靠近工作温度范围的下端时,多个存储器单元。

著录项

  • 公开/公告号US11170838B2

    专利类型

  • 公开/公告日2021-11-09

    原文格式PDF

  • 申请/专利权人 MENTIUM TECHNOLOGIES INC.;

    申请/专利号US202016932239

  • 申请日2020-07-17

  • 分类号G11C11/40;G11C11/406;G11C11/4074;G11C5/02;G11C11/4091;G11C11/4093;G01R19;G01R19/10;G05F1/56;G05F1/575;G11C7/10;G11C11/4094;G11C11/4097;H03K17/22;

  • 国家 US

  • 入库时间 2022-08-24 22:08:32

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