A substrate treatment device (100) comprises a substrate holding unit (120), a chemical feed unit (130), a substrate information acquisition unit (22a), a chemical treatment condition information acquisition unit (22b), and a control unit (22). The substrate information acquisition unit (22a) acquires substrate information including hardened layer thickness information indicating the thickness of a hardened layer in a resist layer of a substrate subject to treatment, or including ion injection condition information indicating conditions for ion injection through which the hardened layer was formed in the resist layer. The chemical treatment condition information acquisition unit (22b) acquires, on the basis of the substrate information, chemical treatment condition information indicating chemical treatment conditions for the substrate subject to treatment, from a learned model. The control unit (22) controls, on the basis of the chemical treatment condition information, the substrate holding unit (120) and the chemical feed unit (130) so as to treat the substrate subject to treatment with a chemical.
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