首页> 外国专利> SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, METHOD FOR GENERATING LEARNING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR GENERATING LEARNED MODEL, AND LEARNED MODEL

SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, METHOD FOR GENERATING LEARNING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR GENERATING LEARNED MODEL, AND LEARNED MODEL

机译:基板处理装置,基板处理方法,用于生成学习数据的方法,学习方法,学习设备,生成学习模型的方法,以及学习模型

摘要

A substrate treatment device (100) comprises a substrate holding unit (120), a chemical feed unit (130), a substrate information acquisition unit (22a), a chemical treatment condition information acquisition unit (22b), and a control unit (22). The substrate information acquisition unit (22a) acquires substrate information including hardened layer thickness information indicating the thickness of a hardened layer in a resist layer of a substrate subject to treatment, or including ion injection condition information indicating conditions for ion injection through which the hardened layer was formed in the resist layer. The chemical treatment condition information acquisition unit (22b) acquires, on the basis of the substrate information, chemical treatment condition information indicating chemical treatment conditions for the substrate subject to treatment, from a learned model. The control unit (22) controls, on the basis of the chemical treatment condition information, the substrate holding unit (120) and the chemical feed unit (130) so as to treat the substrate subject to treatment with a chemical.
机译:基板处理装置(100)包括基板保持单元(120),化学进料单元(130),基板信息获取单元(22A),化学处理条件信息获取单元(22B)和控制单元(22 )。基板信息获取单元(22A)获取包括指示经过处理的基板的抗蚀剂层中硬化层的厚度的衬底信息,或者包括所在的离子注射的离子注射条件的离子注射条件信息。形成在抗蚀剂层中。化学处理条件信息获取单元(22B)基于基板信息,从学习模型中基于基板信息,指示基材进行化学处理条件的化学处理条件信息。控制单元(22)基于化学处理条件信息,基板保持单元(120)和化学进料单元(130)来控制,以便用化学物处理衬底。

著录项

  • 公开/公告号WO2021220633A1

    专利类型

  • 公开/公告日2021-11-04

    原文格式PDF

  • 申请/专利权人 SCREEN HOLDINGS CO. LTD.;

    申请/专利号WO2021JP09836

  • 发明设计人 ANO SEIJI;KOJIMARU TOMONORI;

    申请日2021-03-11

  • 分类号H01L21/027;H01L21/683;

  • 国家 JP

  • 入库时间 2022-08-24 22:06:50

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