AN APPARATUS AND A METHOD FOR FORMING PATTERNS ON A SURFACE OF A SUBSTRATE PLATE BY A SPUTTERING PROCESS

摘要

The invention is an apparatus (100) for forming patterns on a surface of a substrate plate (101 ), comprising a two-part vacuum chamber (102, 103) with a gap (110) between the vacuum chamber parts. A substrate plate is situated verti- cally between the vacuum chambers inside the gap. In one vacuum chamber (102) is a sputtering arrangement (104) and a mask (105), and in another vacuum chamber is a substrate surface heater (106). The side of the substrate plate on which the patterns are to be formed is placed to- wards the sputtering arrangement and another side faces the substrate surface heater. During the sputtering process, the pressure is equal in both vacuum chambers.