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New compound, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method and hardened film forming method, interlayer insulating film, surface protective film, and electronic component
New compound, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method and hardened film forming method, interlayer insulating film, surface protective film, and electronic component
Problem to be solved: the present invention is a compound capable of guiding a polyimide which can be used as a base resin of a photosensitive resin composition capable of forming fine patterns and capable of obtaining high resolution without damaging excellent features such as mechanical strength and solubility, and The purpose of this invention is to provide a polyimide resin obtained by using the corresponding compound and a method for producing the same.A compound characterized by the following formula (1):1No selection
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