首页> 外国专利> New compound, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method and hardened film forming method, interlayer insulating film, surface protective film, and electronic component

New compound, polyimide resin and its manufacturing method, photosensitive resin composition, pattern forming method and hardened film forming method, interlayer insulating film, surface protective film, and electronic component

机译:新型化合物,聚酰亚胺树脂及其制造方法,光敏树脂组合物,图案形成法和硬化成膜方法,层间绝缘膜,表面保护膜和电子元件

摘要

Problem to be solved: the present invention is a compound capable of guiding a polyimide which can be used as a base resin of a photosensitive resin composition capable of forming fine patterns and capable of obtaining high resolution without damaging excellent features such as mechanical strength and solubility, and The purpose of this invention is to provide a polyimide resin obtained by using the corresponding compound and a method for producing the same.A compound characterized by the following formula (1):1No selection
机译:要解决的问题:本发明是一种能够引导聚酰亚胺的化合物,该化合物可用作能够形成精细图案的光敏树脂组合物的基础树脂,并且能够获得高分辨率而不损坏优异的特征,例如机械强度和溶解性。 并且本发明的目的是提供一种通过使用相应的化合物获得的聚酰亚胺树脂和制备方法。其特征在于下式(1)的化合物:1 NO选择

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