Manufacturing method of polyamide resin composition for laser direct structuring, resin molded product, plated resin molded product, and manufacturing method of portable electronic device parts having an antenna

摘要

PROBLEM TO BE SOLVED: To provide a polyamide resin composition for laser direct structuring, a resin molded product, a method for manufacturing a plated resin molded product, and an antenna capable of providing a resin molded product having a high plating growth rate and excellent bending strength. Providing a method for manufacturing portable electronic device parts. SOLUTION: 1 to 30 parts by mass of a laser direct structuring additive, 0.1 to 10.0 parts by mass of an inorganic reducing phosphate, and 10 to 150 parts by mass of an inorganic fiber are added to 100 parts by mass of a polyamide resin. Polyamide resin composition for laser direct structuring, including. [Selection diagram] Fig. 1