Method for producing polyamide resin composition for laser direct structuring, resin molded article, plated resin molded article and method for producing portable electronic device parts

摘要

PROBLEM TO BE SOLVED: To provide a polyamide resin composition for laser direct structuring capable of providing a resin molded article comprising plating which is hard to peeling and has a high plating growth rate, a resin molded article using the resin composition, a method for producing a resin molded article with plating, and a method for manufacturing a portable electric equipment component.SOLUTION: The polyamide resin composition for laser direct structuring is provided which includes 1-30 pts.wt. of a laser direct structuring addition agent, 1-30 pts.wt. of zinc borate and 10-150 pts.wt. of an inorganic fiber with respect to 100 pts.wt. of a polyamide resin, and in which a content of a flame retardant is 5 pts.wt. or less with respect to 100 pts.wt. of the polyamide resin and is 100 pt.% or less of content of the zinc borate.SELECTED DRAWING: Figure 1