PROBLEM TO BE SOLVED: To provide an integrated optical device having high resistance to an impact of wire bonding and the like, and an integrated optical module using the integrated optical device. An optical waveguide 50 is provided with a base 20, an optical semiconductor element 30 provided on a surface 21 of the base 20, a substrate 40, and an optical waveguide 50 provided on the surface of the substrate 40. The surface 61 is arranged so as to face the exit surface 31 of the optical semiconductor element 30, and the light emitted from the optical semiconductor element 30 can enter the optical waveguide 50. The optical semiconductor element 30 has metal layers 75 and 76. The base 20 is connected to the base 20 via the metal layers 71, 72, 73, and the bottom surface 23 of the base opposite to the surface 21 of the base 20 is connected to the substrate 40 via the metal layers 71, 72, 73. It is located at a position protruding from the bottom surface 43 of the substrate opposite to the surface of the substrate 40. [Selection diagram] Fig. 4
展开▼
