Ultralow-power polymer electro–optic integrated modulators

摘要

On-chip integration of electronics and photonics have attracted substantial amount of interest in recent decades. Major obstacles to the realization of this integration are size mismatch between electronic and photonic circuits, as well as issues with ever-increasing requirements for energy efficiency, bandwidth, optical loss, and drive voltage. Another important issue is the absence of photonic materials that make such integration commercially possible in foundry-compatible processes. Future integration involves combination of various materials and platforms. During the last decade there has been an increasing interest in exploiting various photonic platforms to overcome these obstacles. Integration of silicon photonics[1–3] with technologies such as plasmonics[4–6], photonic crystal architectures[7], and hybrid materials[8] have been widely pursued for photonic integration.