WORKPIECE CHEMICAL-MECHANICAL POLISHING SYSTEM, COMPUTATION SYSTEM, AND METHOD FOR GENERATING SIMULATION MODEL OF CHEMICAL-MECHANICAL POLISHING

摘要

The present invention relates to a cyber-physical system which optimizes a simulation model for chemical-mechanical polishing, on the basis of actual measurement data of chemical-mechanical polishing. The chemical-mechanical polishing system is provided with a polishing device (1) which polishes a workpiece (W), and a computation system (47). The computation system (47) has a simulation model which includes at least a physical model which outputs estimated polishing physical quantities including an estimated polishing rate of the workpiece (W). The computation system (47) inputs polishing conditions of the workpiece (W) into the simulation model and outputs the estimated polishing physical quantities of the work piece (W) from the simulation model, and determines model parameters of the simulation model which approximate the estimated polishing physical quantities to the actually measured polishing physical quantities of the workpiece (W).