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SYSTEMS AND METHODS FOR MECHANICAL AND/OR CHEMICAL-MECHANICAL POLISHING OF MICROFEATURE WORKPIECES
SYSTEMS AND METHODS FOR MECHANICAL AND/OR CHEMICAL-MECHANICAL POLISHING OF MICROFEATURE WORKPIECES
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机译:微特征工件的机械和/或化学机械抛光的系统和方法
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摘要
Systems (100) and methods for polishing microfeature workpieces (112). In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece (112) and moving a carrier head (130) and/or a polishing pad (140) relative to the other to rub the microfeature workpiece (112) against the polishing pad (140) after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members (150). The method further includes applying pressure against a back side of the microfeature workpiece (112) in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members (150). In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members (150), a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.
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