CLEANING COMPOSITION FOR POST-ETCH OR POST ASH RESIDUE REMOVAL FROM A SEMICONDUCTOR SUBSTRATE AND CORRESPONDING MANUFACTURING PROCESS

摘要

A cleaning composition for post-etch or post ash residue removal from a substrate used in semiconductor industry and a corresponding use of said cleaning composition is described. Further described is a process for the manufacture of a semiconductor device from a semiconductor substrate, comprising the step of post-etch or post ash residue removal from a substrate by contacting the substrate with a cleaning composition according to the invention.