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Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
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机译:冷却装置和用于冷却双面SIP器件的过程在溅射期间
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摘要
A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.
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