CH A plasmacatalyst for CH bond cleavage with the metal oxide deposed by atomic layer deposition on the surface of porous support and A use thereof

摘要

The present invention relates to a catalyst for activating CH bond by plasma, in which a metal oxide is deposited on a porous support surface by an atomic layer deposition method, and a use thereof. Specifically, a novel structure of a CH bond activation catalyst, a plasma reactor filled with the catalyst, a method of producing C2 or more hydrocarbons in the reactor, and a method of producing hydrogen (H 2 ). The complex system of the plasma and the catalyst according to the present invention can increase the efficiency of the reaction and improve the selectivity of the product due to the complex action of each other.