Thermal Management Systems and Methods for High Power Density EMI Shielded Electronic Devices

摘要

Thermal management methods and systems for high power density EMI shielded electronic devices. In one embodiment, the electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electromagnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the at least one EMI shield fence; a heat sink EMI shield cap secured on the at least one EMI shield fence; wherein the heat sink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence, and wherein the heat sink EMI shield lid is thermally conductive with the at least one integrated circuit. and a spring-loaded thermal interface making contact.