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SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES
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机译:用于高功率密度EMI屏蔽电子设备的热管理系统和方法
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摘要
Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.
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