Dual sided copackaged opto technology for high bandwidth networking applications

摘要

Problem to be solved: to provide optical packaging for high bandwidth networking applications.The electronic package 100 comprises a first package substrate 105 and a second package substrate 106 mounted on a first package substrate.A die 110 is mounted on the second package substrate.A plurality of optical engines 120 are mounted on the first and second surfaces of the first package substrate.A plurality of optical engines are communicatively coupled to the die through a first package substrate and a second package substrate.Diagram