DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

摘要

Embodiments disclosed herein include electronic packages for optical-to-electrical switching. In an embodiment, an electronic package includes a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, the die is attached to the second package substrate. In an embodiment, the plurality of photonic engines are attached to the first surface and the second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die via a first package substrate and a second package substrate.