THERMALLY CONDUCTIVE MATERIAL-FORMING COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND FILM

摘要

The present invention provides a thermally conductive material-forming composition from which a thermally conductive material having excellent thermally conductive properties can be obtained. Moreover, a thermally conductive material formed of the thermally conductive material-forming composition, a thermally conductive sheet, and a device with a thermally conductive layer are provided. Further, the present invention provides a film from which a thermally conductive sheet having excellent thermally conductive properties can be prepared. Furthermore, a thermally conductive sheet prepared using the film, and a device with a thermally conductive layer are provided. The thermally conductive material-forming composition according to the embodiment of the present invention is a thermally conductive material-forming composition including an epoxy compound, one or more kinds of phenolic compounds selected from the group consisting of a compound represented by General Formula (1) and a compound represented by General Formula (2), and an inorganic substance, or the like.;