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Manufacturing method of quilting cloth using pottery chip and quilting wear using it

机译:绗缝布用陶器芯片和绗缝磨损用绗缝布

摘要

The present invention relates to a method for manufacturing a quilted fabric using a ceramic chip including a carbon layer and a quilted garment using the same, wherein the outer fabric, the first nonwoven, the quilted chip, the second nonwoven and the inner fabric are sequentially overlapped, The step of overlapping the quilting chips arranged in accordance with the sewing pattern, and sewing the overlapped outer fabric, the first nonwoven, the chip for the quilting, the second nonwoven and the inner fabric in a first direction, but back-stitching at a predetermined interval and sewing the overlapping outer fabric, the first nonwoven, the quilting chip, the second nonwoven, and the inner fabric in the second direction, and performing backstitching at predetermined intervals, wherein the The chip for quilting provides a method of manufacturing a quilted fabric using a ceramic chip produced by molding a ceramic material formed by mixing ocher, clay and elvan in a certain ratio and a carbon layer formed inside the ceramic material. can
机译:本发明涉及使用包括碳层和绗缝衣物的陶瓷芯片制造绗缝织物的方法,其中外织物,第一非织造,绗缝芯片,第二非织造和内织物是顺序的重叠,重叠根据缝制图案排列的绗缝芯片的步骤,并缝制重叠的外织物,第一非织造,用于绗缝的芯片,第二非织造和内部织物在第一方向上,但背包缝合以预定的间隔和缝制重叠的外部织物,第一非织造织物,绗缝芯片,第二非织造件和内织物,并且以预定间隔执行反静量,其中用于绗缝的芯片提供了一种制造方法使用通过在一定比例和汽车中模制通过混合赭石,粘土和ELVAN而形成的陶瓷材料而产生的陶瓷芯片的绗缝织物在陶瓷材料内部形成的BON层。能够

著录项

  • 公开/公告号KR20210112769A

    专利类型

  • 公开/公告日2021-09-15

    原文格式PDF

  • 申请/专利权人 박종원;권영철;

    申请/专利号KR20200028226

  • 发明设计人 박종원;권영철;

    申请日2020-03-06

  • 分类号D05B11;C04B33/04;C04B33/13;D03D15;D04H13;

  • 国家 KR

  • 入库时间 2022-08-24 21:03:19

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