CMOS NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION CURED FILM OBTAINED BY CURING SAME METHOD FOR PRODUCING CURED FILM OPTICAL DEVICE PROVIDED WITH CURED FILM AND BACKSIDE-ILLUMINATED CMOS IMAGE SENSOR

摘要

It has high refractive index, high transparency characteristics without adding post-exposure process, has high sensitivity in exposure, has excellent resolution and solvent resistance after pattern formation, and obtains a rectangular cross-sectional pattern suitable for pixel formation and barrier rib formation. It is an object to develop a negative photosensitive resin composition that can be As a negative photosensitive resin composition containing the following (a)-(d), (a) metal compound particles (b) polysiloxane compound (c) a compound having at least one group comprising an α,β-unsaturated carboxylic acid ester structure (d) photopolymerization initiator (e) The compound which has a maleimide group is contained further The said subject is solved by the negative photosensitive composition characterized by the above-mentioned.