首页> 外国专利> AIRBRIDGE FOR MAKING CONNECTIONS ON SUPERCONDUCTING CHIP, AND METHOD FOR PRODUCING SUPERCONDUCTING CHIPS WITH AIRBRIDGES

AIRBRIDGE FOR MAKING CONNECTIONS ON SUPERCONDUCTING CHIP, AND METHOD FOR PRODUCING SUPERCONDUCTING CHIPS WITH AIRBRIDGES

机译:用于在超导芯片上进行连接的Airbridge以及用空气桥的超导芯片生产方法

摘要

An airbridge implements connections on a superconducting chip. It comprises a strip of superconductive material between a first superconductive area and a second superconductive area. A first end of said strip comprises a first planar end portion attached to and parallel with said first superconductive area, and a second end of said strip comprises a respective second planar end portion. A middle portion is located between said first and second planar end portions, forming a bend away from a plane defined by the surfaces of the first and second superconductive areas. First and second separation lines separate the end portions from the middle portion. At least one of said first and second separation lines is directed otherwise than transversally across said strip.
机译:Airbridge在超导芯片上实现连接。 它包括第一超导区域和第二超导区域之间的超导材料条带。 所述条带的第一端包括与所述第一超导区域附接并平行的第一平面端部,并且所述条带的第二端包括相应的第二平面端部。 中间部分位于所述第一和第二平面端部之间,形成远离由第一和第二超导区域的表面限定的平面的弯曲。 第一和第二分离线将端部与中间部分分开。 所述第一和第二分离线中的至少一个比横跨所述条带横向指导。

著录项

  • 公开/公告号US2021265261A1

    专利类型

  • 公开/公告日2021-08-26

    原文格式PDF

  • 申请/专利权人 IQM FINLAND OY;

    申请/专利号US202016932350

  • 申请日2020-07-17

  • 分类号H01L23/522;H01L27/18;H01L23/532;H01L21/768;

  • 国家 US

  • 入库时间 2022-08-24 20:47:45

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